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The sample morphology, nanotube yield, defect concentration and amount of carbonaceous impurities, as well as the mean diameter and the diameter distribution of the SWCNTs were analysed by combined scanning- and transmission electron microscopy, Fourier Transform Raman spectroscopy and optical absorption spectroscopy.
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Furthermore, overall yield is composed of five subcategories: systematic yield, parametric yield, defect-related yield, design-related yield, and test-related yield.
In product manufacturing, it is indispensable to evaluate P y i =−1|x i ) because we can avoid to yield defects which may cause a severe damage in manufacturing company if we know P y i =−1|x i ) (see e.g., Katayama et al. [3], Sun & Li [11]).
But the joints fabricated using THC and TTC profiled tools yielded defect free stir zones in both air and water cooling medium.
Of the four tool pin profiles used in this investigation, straight threaded cylindrical (THC) pin profile and taper threaded cylindrical (TTC) pin profile yielded defect-free weld surface and stir zone formation in both air cooling and water cooling medium.
An internal deletion within the catalytic core of EP400 yields defects in embryonic development and primitive hematopoiesis in mice [ 70].
Given the very high percentage of both integrin-adhesome and muscle attachment gene knockdowns that yielded defects in muscle, we performed RNAi against a set of 10 knockdowns previously shown to produce a movement defect but not a subcellular defect in muscle (subset of genes from ref. 18) and, as expected, failed to find defects in muscle despite finding impaired movement.
Although there have been several demonstrations of this self-assembly fabrication process, rules that govern a priori design, yield and defect tolerance remain unknown.
In their paper, Westgard, Koch and Oryall [5] used the batch size and the observed frequency of errors to estimate the test yield and defect rate.
Before I.B.M. offers commercial quantities of strained silicon devices to its hardware divisions and outside customers, it must improve the yield of defect-free chips from the new process, said Bijan Davari, vice president for semiconductor development for I.B.M.'s microelectronics manufacturing group.
Systematic identification and classification approaches have been introduced to improve the process yield by defects sampling and images reviewing.
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