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Figure 3 The relation between critical stresses and void size.
The use of P and FC widened the paste shell, reducing the active void size.
Paste thickness and active void size were identified as PLCM macrostructural parameters.
From the numerical viewpoint, the most impacting position of void depends highly on the void size.
Two controllable parameters, i.e., the void size and the TB spacing, are noted as d and λ, respectively.
The void size dependence of yielding stress in our simulated samples is attributed to the effect of surface stress.
Finally, a new model relating void size and spacing to obstacle strength is proposed.
Void size distributions of the structures are presented, together with much Supplementary Information.
It is shown that the critical stress for dislocation emission decreases with increasing void size.
In all cases, the void size increased and the void volume fraction decreased on drying.
Damage variables, such as the spatial distribution, or void size, were recorded by the digital image processing tool.
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