Exact(5)
Then, the effect of the number of reflow cycles on the void density was investigated.
Different peak reflow temperatures were adopted to analyze the change in the void density.
The void density increased with the number of reflow cycles, but not with the peak reflow temperature.
Then, void density contour and probabilistic description methods, such as two-point correlation and lineal-path functions, are used to describe the void distribution inside the specimen.
In situ 3-D microtomography has been instrumental to assess these models from experimental evolution of average void density and size.
Similar(3)
Quantitative agreement is reached between the model and experimental data for lifetimes and void densities in pure Al, as well as AlSiCu and AlCu from previous investigation.
For the deposited thin films small voids are formed and the voids density decreases considerably with increasing Cu content.
This may support the phenomenon described by El-Ma'aita et al. [ 10] where prolonged activation times may rearrange the MTA particles leading to changes in the numbers of voids, density, and microhardness.
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