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VIA techniques have the ability to generate a graphical representation of the density of immunostaining within a tissue section.
The combining of consistent distributions is addressed via techniques from the opinion pooling literature.
The acoustic responses are analysed via techniques from dynamical systems theory such as Poincaré plots and bifurcation diagrams.
In this model, SUs are assumed to have their position information available, which could be obtained via techniques proposed in [30, 31].
Furthermore, in our study we considered the downlink unicast only; another avenue that needs further investigation is the use of downlink broadcast [22] via techniques like MBMS to improve downlink data channel capacity.
Furthermore, this approach has potential applications in developing ultra-small devices via techniques such as pattern transfer owing to its simplicity, effectiveness and low cost, especially regarding to fabrication time.
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This study provides useful suggestions for manufacturing and reliability assessments of 3D heterogeneous microsystem modules embedded using the through-silicon via technique.
Via this technique barely visible impact damages could be detected, localised and characterised (damage mapping).
Interfacial reliability is a challenging issue in through-silicon-via (TSV) technique.
Approximate and score-based name matching techniques (via web services).
Moreover, the correlation between visual techniques (VIA, VILI, and colposcopy) might have been another contributory factor.
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