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The root extract of C. borivilianum is potentially useful for male infertility treatment via overcoming impairment in sperm characteristics and via reducing percentage and appearance of abnormal sperm in diabetes.
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CCND1 is preferentially associated with cyclin-dependent kinases 4 and 6, which inactivate the retinoblastoma tumor suppressor protein via phosphorylation, thereby overcoming the Rb-mediated blockade of G1 and facilitating G1-S progression.
Other ongoing challenges include those related to infrastructure: although the use of mobile phones for data reporting via SMS overcomes many of the issues associated with data collection from health centers in remote areas, maintaining internet access and a steady electrical supply is still challenging in remote areas, even at the district headquarters.
All four superstars were involved at Payback, with Sheamus overcoming Cesaro via a small package pin and Barrett defeating Van Dam with a Bull-hammer.
SBMLsqueezer facilitates exactly this modeling step via automated equation generation, overcoming the highly error-prone and cumbersome process of manually assigning kinetic equations.
The potentiation of the efficacy of VP-16 by β-elemene may be mediated by the increase of Bax, p53, and p21 and the suppression of Cyclin D1 [ 79]. β-Elemene plays an important role in overcoming MDR via multiple mechanisms.
3D integration technologies with a high density of through-silicon-vias can help overcome these limitations.
Effective hydrophilization and functionalization of PVDF membrane was realized via polydopamine (PDA) deposition, thus overcoming the drawbacks of hydrophobic substrates including poor water permeability, inert property as well as severe non-specific adsorption.
Therefore, the increased radiosensitivity of ECs in SAS-R tumors via Everolimus was efficient for overcoming radioresistance.
Therefore, increasing cellular Th1 cytokine induction via vaccination is thought to be an important strategy for overcoming EV71 infections.
Overcoming the difficulty of making interconnection line on 3D MEA chips via innovative fabrication process design.
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