Sentence examples for via filling from inspiring English sources

In order to optimize TSV design and the quality of via filling, a numerical model of Cu-filled TSV was established to simulate and analyze the effect of diameter, aspect ratio (AR) and defects on TSV thermal stress and deformation in this paper.

The supported LaNiO3 perovskite catalysts on mesoporous carrier (LaNiO3/SBA-15, LandO3/MCM-41 and LaNiO3/SiO2) with different pore structures have been synthesized via filling the pores of mesoporous silica with citrate complex precursors of nickel and lanthanum, with further treatments.

It usually requires temporary bonding or attaching technology with Cu seed layer at the bottom to complete the via filling process.

One of the advantages of the bottom-up TSV approach is the ability to avoid seams or voids during via filling [28, 29].

Furthermore, TSV fabrication has various important processes, including via formation by deep reactive ion etching (DRIE), lining with dielectric layer, barrier and seed layers, via filling, chemical mechanical polishing (CMP), and Cu revealing process.

The sample was introduced via filling ports.

(b) Via filled with the dielectric and Au UBM dispensed on top by SIJ.

Despite soaring sales of smartphones and tablets and the extravagance of the new venue – the Toyo Ito-designed Fira Gran Via filled with wave-like forms to reflect its coastal location – the mood will be gloomy.

(a) SEM images of solder paste deposited on the vias filled with dielectric polymer and covered by printed UBM.

Figure 7 illustrates cross sections of the vias filled by SIJ printing with the dielectric polymer after temperature cycling tests with (a) 250 cycles, (b) 750 cycles, and (c) 1000 cycles.

It was concluded that the SIJ technology is a better alternative compared to inkjet printing regarding dispensing of metal inks for the UBM pads on top of the vias filled with a dielectric polymer.