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The logical layout is depicted by using package diagram where each package initially represents one subsystem.
Electromigration in dual damascene copper interconnects was investigated using package level electromigration tests and failure analysis techniques.
Their investigations showed that using package and design studs based on capacity leads to increase shear strength.
In this work, thermal cyclic test is performed to re-examine these factors using package housed on a flex substrate.
Statistical analyses were performed using package R, version 3.0.2 (R Foundation for Statistical Computing, Vienna, Austria) and Minitab version 16.2 (Minitab Inc., University Park, USA).
To explore the factorial structure of the instrument, factor analyses (EFA) for ordinal data derived from Likert-type scales were performed using package FACTOR (Lorenzo-Seva & Ferrando, 2006).
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All statistical analyses were performed in RStudio (version 0.98.983) using packages phyloseq 1.14.0 [13], DESeq2 1.10.1 [14] and ggplot2 2.1.0 [15].
Instead of homemade gingerbread, simplify things using packaged graham crackers.
Halloween graham cracker house: Instead of homemade gingerbread, simplify things using packaged graham crackers.
Array images were processed using packages from the Bioconductor project [33].
All calculations were done in R [44], using packages vegan and sem.
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