Before the deposition of the multilayers, deposition rates of the individual layers were determined accurately by measuring the thickness of each layer using a Dektak profilometer (Dektak 6M Stylus Profiler, Veeco, Plainview, NY, USA).
Film thicknesses were measured using a Dektak profilometer.
After fabrication, their thicknesses were measured using a Dektak profilometer (Veeco Inc, Camarillo, CA 93012).
The film thickness was measured using a Dektak 150 profilometer (Veeco Instruments Inc., Plainview, NY, USA).
The microchannel dimensions following hot embossing were verified using a Dektak 8 profilometer (Vecco Instruments, Santa Barbara, CA, USA).
These samples had a thickness of approximately 300 nm, which was measured using a Dektak 3 profilometer.
The film refractive index and the film thickness were measured using a null Ellipsometer Gaertner L117 (Gaertner Scientific Co., Chicago, IL, USA) with a laser of He-Ne (632.8 nm); the film thickness was measured using a Dektak 150 profilometer (Veeco Instruments Inc., Plainview, NY, USA).
Film thicknesses were measured using a Dektak Surface profilometer and AFM surface topography images were acquired using an Agilent 5500 system in close-contact tapping mode.
A Dektak profilometer was used for TiN thicknesses evaluation and ellipsometry for the thinner Ni films.
Surface grafts were then characterized by profilometry using a Dektak 6 M Stylus Proilometer (Veeco Instruments, Inc., Woodbury, NY) to determine graft thickness.
The thickness of the different layers was measured using a profilometer (Dektak 150 Surface Profilometer; Veeco).
