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In situ tensile test using a micromechanical device inside a scanning electron microscope (SEM) is carried out to evaluate the mechanical performance of individual GNR-reinforced CNF.
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The article presents a novel electrostatic field sensor realized using a micromechanical component.
In particular, the potential of the process is characterized using a micromechanical modelling combined to a parametric probabilistic model.
In this work the out-of-plane stresses inside a woven laminate were numerically evaluated using a micromechanical model.
Using a micromechanical displacement sensor, we experimentally derive the lateral, vertical and angular stiffness constants of our MIS.
The actuator is built using a micromechanical bulk silicon process yielding structures with a low rotational spring constant due to beams with a high length to width ratio.
Self-accommodation of the transformation eigenstrain was evaluated for various bainite configurations using a micromechanical model.
When voids exist, flexural modulus was calculated using a micromechanical model.
This paper presents a virtual framework for deriving a full-field elastic response of continuous fibre unidirectional (UD) composites using a micromechanical modelling approach.
Using a micromechanical testing system, the shear modulus of the annular ligament was calculated to change from 3.6 to 220 kPa when the shear stress increases from 2 to 140 kPa.
Recently, a direct uniaxial tensile test was performed with a micromechanical device to measure the fracture toughness of graphene with a pre-crack [18].
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