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The samples were prepared using a hot bonder.
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The microstructures were replicated into the PMMA substrate by embossing under 4.3 MPa at 130°C using a hot embosser-substrate bonder (520-HE, EVG, St. Florian, Austria).
Bed stress measurements were conducted using a hot film sensor.
Try using a hot towel.
Wash using a hot setting.
Be careful using a hot glue gun.
Be careful when using a hot stove.
Take care when using a hot stove.
Use appropriate caution when using a hot oven.
Always use protective gloves when using a hot oven.
Some of the samples were cured in an autoclave process, the others were cured by means of a Hot Bonder (mobile curing system especially for repair applications).
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