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For this purpose, an aluminum stud with a 70.5 mm2 contact area was attached to the solder mask surface by using a heat curing epoxy adhesive (SMT-Adhesive PD955M, Heraeus Materials Technology GmbH & Co.KG, Hanau, Germany).
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Consider using a heat sink.
Try using a Heat Defence Spray/Shampoo.
Bend it by using a heat gun.
Finally, the resulting paste was casted in a mold and cured using a heating procedure: 80 °C/10 h + 100 °C/3 h + 150 °C/3 h, forming the ER-1% BNNS composite sheets as testing samples.
You may use a heat lamp or other portable heat source to help cure the sealant, but do not heat above 110 degrees (F).
Use a heat pad.
Use a heat protectant.
Use a heat treatment.
Use a heat gun.
Use a heat pack or heating pad.
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