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Two-inch n-type silicon 100 wafers were cut into four quarter pieces, using a diamond wafer saw.
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Alternatively, fossils may be prepared by producing serial thin sections or "wafers" of material using a diamond wafering blade on a lapidary saw (Stein et al., 1982; Hass and Rowe, 1999).
Specimens were sectioned longitudinally using a diamond wafering saw and polished with alumina grit prior to staining with van Gieson's picrofuchsin (where mineralized tissue stains red) and Stevenel's blue (where proteoglycan stains deep blue) (Maniatopoulos et al. 1986).
This concept is implemented in this work using a diamond tip as the cutting tool and coated silicon wafer and metal specimens as the workpiece.
We begin by dicing the 8 inch wafer into 1 cm × 1 cm chips using a diamond saw.
This was done using a diamond bur handpiece.
Embedded blocks were sectioned on a Struers Accutom-50 precision cut-off saw (Struers, Copenhagen, Denmark) using a R330 diamond wafered wheel under water irrigation.
After microcomputed tomography scanning, two transverse sections (∼50 microns thick) were cut from the diaphysis of long bones using an Isomet saw with a diamond wafer blade for cortical studies.
The proposed diamond encoding method uses a diamond function to compute the diamond characteristic value (DCV) in embedding and extraction procedures.
You could also use a diamond layout.
If you only use a diamond tester, it will show "diamond" when you actually have moissanite.
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