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Exact(52)
Embedded pellets of R. sphaeroides cells were serially sectioned with an EM-UC6 ultramicrotome (Leica Microsystems) using a diamond knife (Diatome-US, Hatfield PA).
We sectioned embedded samples to approximately 60 nm by using a diamond knife (DiATOME US, Hatfield, PA, USA) on an Ultramicrotome Leica EM UC7 (Leica Microsystems, Wetzlar, Germany).
The interior morphology of microPCM was exposed by microtoming microcapsules using a diamond knife.
Sections from both sample types were cut using a diamond knife (Diatome) at a thickness between 200 and 300 nm.
Finally, the acetone-infiltrated cells were embedded in resin, and the blocks containing the cells were cut into thin sections in 500 or 50 nm using a diamond knife.
Blocks were trimmed using a glass knife and 70 nm sections cut using a diamond knife.
Similar(8)
Ultrathin sections (50 nm thick) were cut using a Diatome diamond knife and picked up onto copper (carbon coated) grids (200 mesh) then stained with 0.5 % uranyl acetate for 2 h and 3%% lead citrate for 5 min before viewing in a Philips CM120 electron microscope.
The PMNC samples were prepared by embedding several granules in the epoxy resin followed by cutting with an ultramicrotome (Leica EM UC6, Leica Microsystems Ltd., Milton Keynes, UK) using a 35° diamond knife (Diatome, Hatfield, PA, USA) at liquid nitrogen temperature (−160°C).
The 70 nm sections were cut on a Lieca UC6 ultramicratome using a Diatome diamond knife.
Sections were cut at 70 80 nm using a Diatome diamond knife and an RMC MT6000-XL ultramicrotome.
Sections of 60 nm or less were cut using a Diatome diamond knife on a Leica Ultracut UCT and placed onto a copper grid.
More suggestions(15)
using a diamond particle
using a diamond cell
using a diamond indenter
using a diamond wafer
using a craft knife
using a butcher knife
using a diamond stylus
using a diamond crystal
using a diamond T-saw
using a diamond sheet
using a diamond scriber
using a diamond tip
using a diamond disk
using a diamond band
using a diamond module
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