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We sectioned embedded samples to approximately 60 nm by using a diamond knife (DiATOME US, Hatfield, PA, USA) on an Ultramicrotome Leica EM UC7 (Leica Microsystems, Wetzlar, Germany).
Embedded pellets of R. sphaeroides cells were serially sectioned with an EM-UC6 ultramicrotome (Leica Microsystems) using a diamond knife (Diatome-US, Hatfield PA).
Nanoindentation tests of various multilayered crystalline specimens were conducted using a diamond indenter.
The interior morphology of microPCM was exposed by microtoming microcapsules using a diamond knife.
One sample for each as-deposited pair was divided into three samples using a diamond scriber.
After that, this plate is cut using a diamond wheel saw.
A method for drilling holes in engineering ceramics by using a diamond tool has been developed.
The crowns were cut off at the cement-enamel junction using a diamond disk (KG Sorensen, Barueri, SP, Brazil).
Sections from both sample types were cut using a diamond knife (Diatome) at a thickness between 200 and 300 nm.
We begin by dicing the 8 inch wafer into 1 cm × 1 cm chips using a diamond saw.
Two-inch n-type silicon 100 wafers were cut into four quarter pieces, using a diamond wafer saw.
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