Water/air system was used at atmospheric pressure and ambient temperature.
In addition, a hydrophobic surface is able to make the patterned ETFE film water insoluble and can be used at atmospheric environment.
For the experiments, 60 g of Al2O3 (5.5 wt% H2O) in a stainless steel reactor and 2 ml/min of CO2 carrier gas were used at atmospheric pressure.
Various mass flow rates from 600 to 1000 l/min were used at atmospheric conditions with a geometrical swirl number of 0.913.
Air as a gas coolant, water and sodium chloride solution as liquid coolants were used at atmospheric pressure to cool down the melt and generate crystals.
It is noted that the patterned silk film on the surface of silicon is treated with methanol solution to make the patterned silk film water insoluble and can be used at atmospheric environment.
High-purity, vertically-aligned single-walled CNTs (SWCNTs) were synthesized only when PECVD was used at atmospheric pressure, while multi-walled CNTs were preferentially synthesized when the total pressure was lower than 20 kPa.
Alternative soft ionization techniques including ESI have been developed which can be used at atmospheric pressure.
