This paper summarizes recent results pertaining to the ultrasonic micro-drilling process obtained with a semi-industrial 3-axis machine.
The chip-based design features integrated heating manifolds and is interfaced with a piezo-electric ultrasonic micro-pump for efficient chip actuation.
The structure consists of a sandwich of silicon silicon Pyrex layers fabricated using MEMS technologies, in which deep reactive ion etching (DRIE) and ultrasonic micro-machining techniques were used for the fabrication of silicon and Pyrex chips, respectively.
A dynamic model is used to describe the process of ultrasonic micro-forging where the material to be worked is considered as a nonlinear connecting-link between the ultrasonic transducer and passive waveguide-reflector.
Piezo-electric cut takes place thanks to a modulate ultrasonic micro-vibration of 60-200 micro-meters of wideness, that it is able to cut all the mineralized tissues with the utmost respect to the soft tissue, impossible to damage even in an accidental contact.
Experimental results show that the embedded tissue can be quickly and precisely cut with the ultrasonic vibration micro-dissection method.
A novel Ultrasonic Vibration Micro-dissection (UVM) method was proposed to procure pure population of targeted cells from tissue sections for subsequent analysis.
In the hope of obtaining a precise microdeposition, an ultrasonic-based micro powder-feeding mechanism was developed in order to form thin patterns of dry powders that can be cladded or sintered onto a substrate by a micro-sized laser beam.
His recent research includes piezoelectric MEMS energy harvesting, micro ultrasonic transducers and nano-engineered energy conversion for carbon neutrality and solar water splitting systems.
Miniaturizing the preload mechanism is key for implementation of a micro ultrasonic motor with the best performance into micro devices.
