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Materials are chosen whose properties allow a model to be developed that could represent a multi-layer food product or biological structure, to enable ultrasonic cutting systems to be designed for applications both in the field of food processing and surgical procedures.
Initial finite element models are created, based on the assumption that the ultrasonic blade causes a crack to propagate in a controlled mode 1 opening, and these are validated against experimental data from three point bend fracture tests and ultrasonic cutting experiments on the materials.
In this paper, several experimental analyses have been performed, complemented by the use of Abaqus/CAE finite element analysis, in order to develop a high-power ultrasonic cutting device for bone surgery using a new configuration of cymbal transducer, which is optimised for operation at high displacement and high input power.
By applying NASA technology it developed an ultrasonic cutting machine that doubled output and reduced waste by 80%.
Using a single-blade ultrasonic cutting device, a study of ultrasonic cutting of three very different materials is conducted using specimens of cheese, polyurethane foam and epoxy resin.
Subsequently, the finite element model is developed to represent ultrasonic cutting of a multi-layered material.
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The determined tool geometry with the aid of the computer simulation is demonstrated through actual data of ultrasonic vibration cutting.
Preliminary characterisations of the resulting prototype ultrasonic bone cutting device, which operates at around 25 kHz, illustrate the success of this novel device design.
After building the measurement system, experiments and finite element simulations are carried out based on an orthogonal one-directional ultrasonic vibration cutting model, respectively.
Ultrasonic vibration cutting as a cutting process has been widely used in the precision machining of difficult-to-cut materials due to an enhanced cutting stability and increased productivity.
Moreover, the effect of ultrasonic vibration on cutting force and chip micro-hardness is evaluated.
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