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Beneath the oceans, the typical thickness of the crust is only six to seven kilometres.
The typical thickness of the oxide semiconductor film after one operation is about 2.4 μm, measured by cross-sectional SEM, as shown in Fig. 1(f).
The typical thickness of the deposited layers ranged from 1 to 1.3 μm depending on process parameters.
Ultrafine grains are observed both in the chip and the subsurface, at depths relevant to the typical thickness of the irradiation-induced damage.
The typical thickness of the Mo/Si multilayer coatings generally adopted in EUVL is about 300 nm, which is much greater than the operating wavelength of 13.5 nm.
Wirescanners employ thin wires with typical thickness of the order of tens of microns that are scanned across the beam, whilst ionizing radiation generated from the impact of the electrons with the wires is detected.
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This scaling persists up to a depth of 5 mm, which is larger than the typical thickness of an ant's gaster (see the calibration in Fig. 2).
The typical thickness of practical components is often beyond the thin plate theory limit and it may have considerable effect on sound radiation.
The typical thickness of carbon film, determined by measuring the step height after lithography, was 3 to approximately 5 nm.
A relatively thin soil horizon with a typical thickness of 2 3 m covers the study area; this soil horizon has not been described separately, rather it is merged with the top clay layer.
Compared to the typical thickness of solid-state semiconductor cantilevers (less than 1 µm), the thickness of SU-8 cantilevers is kept more than 1 µm mainly to ensure mechanical stability of the cantilever platform.
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