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The newly developed patterns functioned well as masks for transferring patterns on Si substrates by reactive ion etching.
For prepatterned guided anodization, imprinting methods have been used by several author groups to prepare ordered AAO, wherein nanoindentations are created by transferring patterns from hard master stamp onto the Al surface under a high pressure 5-255 kN cm-2) before anodization [8 10].
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These techniques above have partially the same process: they can transfer patterns onto the surface of a substrate.
Involved nanomold imprinting to transfer patterns on a substrate, sacrificial layers deposition for bulk silicon substrate etching and polymer replication processes, which cause the nanostructure manufacturing process being difficult, time-consuming, and expensive.
However, according to Odom and the team from Harvard University, the low elastic modulus of PDMS mold will lead to feature deformation of the transferred patterns due to high loading imprint force [62].
Regardless, the majority of students from both groups was able to successfully complete the modeling and guided inquiry assignments, the outcomes of which indicated that they perceived and were able to transfer patterns of similarity and differences.
The genes in the second (putatively vertically inherited) and third (putatively horizontally transferred) patterns could have been established in the common ancestor of STX+ and STX− cyanobacteria; however, they were subsequently lost differentially from STX− cyanobacteria.
Current transfer techniques are either limited by the type and shape of the target substrate, or their inability to transfer patterned and thin VACNT arrays.
The transferred pattern will be significantly damaged by a strong adhesion under smaller feature size.
The effect of aperture size on the transferred pattern has previously been demonstrated for metallic nanowire fabrication [31].
The square has a lateral size of 950 nm × 950 nm slightly below 1 μm × 1 μm, indicating a small shrinkage of the transferred pattern, which could be due to fluctuations during one of the pattering steps.
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