Sentence examples for thin interconnections from inspiring English sources

In comparison, Dll4+/− papillomas showed ~35%% increase in vessel density, measured as the PECAM– positive area per tumor stromal surface (p < 0.05, Fig.  2a), forming more disorganized endothelial networks with pronounced branching and thin interconnections (data not shown).

The approach provides useful information on the stabilities of phases (microstructures), driving forces for chemical reactions and growth rates of reaction products occurring in interconnections or thin film structures during processing, testing and in long-term use of electronic devices.

The resulting ZSM-5 catalysts were formed via the interconnection of very thin pillars or lamellae; (1) ∼6 nm thick with marked mesoporosity (H_30; high mesoporous ZSM-5) and (2) ∼13 nm thick without any considerable mesoporosity (L_30; low mesoporous ZSM-5).

The method developed for chip embedding and interconnections is named Ultra Thin Chip Package (UTCP).

Electrical interconnections are made by thin-film metal layers that coat etched flow channels patterned on an insulating substrate.

Integrated circuit (IC), also called microelectronic circuit or chip, an assembly of electronic components, fabricated as a single unit, in which miniaturized active devices (e.g., transistors and diodes) and passive devices (e.g., capacitors and resistors) and their interconnections are built up on a thin substrate of semiconductor material (typically silicon).

Thin Cu films are widely used in electronic interconnections and micro-electromechanical systems (MEMSs); however, most studies have focused on temperature-dependent dynamic properties at larger scales.

This quartz resonator is designed with sealing bonding, wafer thinning, and Cu TSV interconnection.

This silicon-based quartz resonator package is achieved by the Cu TSV interconnection, wafer thinning process, and sealing bonding techniques.

To solve this issue, mechanical compression of the photoanode thin film was adopted to increase the effective interconnection between NPs.

Ta Si N thin films were applied as diffusion barriers for Cu interconnections or hard coatings in mechanical application.