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Deep diffusion layer with high hardness up to HV900 below the surface thin compound (γ′-Fe4N) layer was formed in these alloys.
The microstructure developed at 600 °C consisted of a thin compound layer (<2 µm) and a deep nitrogen diffusion zone (~45 µm) while the bulk microstructure was maintained with only 40% grain growth.
The 76% N2 24% H2 gas composition produces thick compound layers and diffusion zones whereas the 5%N2 95%% H2 gas composition results in a thin compound layer and thick diffusion zone.
By this complex treatment combining ion-nitriding with subsequent ion plating, the surface hardened layer was composed of a thin outermost coating layer of TiN with a hardness of approximately 2300 Hv, a thin compound layer of ε+γ′ with a hardness of 800 1000 Hv and a thicker inner diffusion layer of approximately 600 800 Hv.
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The best wear performance of solely plasma nitrided samples could be attributed to thicker compound layers and deeper hardened cases compared to shot-peened + plasma nitrided samples, which exhibited shallower case depths and thinner compound layers.
The blood-thinning compounds the researchers found were effective, but not nearly as powerful as, for example, heparin, a common blood thinner.
Furthermore, when the strain rate of 2 × 10−1 s−1 was applied, the solder joint with a thin intermetallic compound layer was completely broken inside the Cu6Sn5 layer, but partly broken at the Cu6Sn5/Cu3Sn interface for the joints with a thick intermetallic compound layer.
In the present study, bismuth telluride compound thin film was grown by means of electrochemical atomic layer epitaxy (ECALE) with an automated thin layer flow cell deposition system.
It was found that a β-C3N4β-C3N4und thin film was formed in the implanted layer.
Nichia's blue LEDs are made up of thin films of compound semiconductor material, just a few billionths of a meter thick, that are laid down like coats of spray paint using a process called metal-organic chemical vapor deposition.
An amorphous (a-) Ti TiB2 compound thin film which consists of Ti and TiB2 with a low hardness value was formed without nitrogen doped.
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