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Nanostructures with different thicknesses of adhesion layer.
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To extensively compare the results between with and without intermediate adhesion layer, we executed the experiments with the different thickness of adhesion layer and employed the hemispherical nanostructure coated with a 20-nm Au film, with fixed structural parameters and other conditions.
In this study, the influence of thickness on adhesion properties of titanium-tungsten (TiW) thin films on silicon substrate has been investigated.
In this paper, the role of roughness and film thickness on adhesion, friction, and wear of the interface is studied.
A parametric study was also conducted to investigate the effects of material properties and coating/substrate thickness on adhesion loss.
Due to the increase in damping plasmonic resonance with increasing the thickness of the adhesion, we suggest the suitable adhesion of Ti layer below 5 nm and of Cr below 2 nm.
The magnitude of resonance damping has also been found when the thickness of the adhesion layer increases.
Results have shown that a 90 nm fluoropolymer film shows the optimal film thickness in terms of adhesion stability and corrosive resistance.
The behavior of an elastic layer in contact with a wavy rigid substrate is analyzed depending on layer thickness, substrate geometry, energy of adhesion, for given value of remote applied load or penetration.
This tends to give values approaching the true work of adhesion at small thickness and greater values of the practical work of adhesion at larger thickness, all being in the 30 30,000 nm range.
The results also revealed that with increasing the thickness of TiW layer, adhesion toughness of the coating decreases.
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