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This article provides an overview of recent research on these package functionalities and summarises the performance parameters used to quantify them.
These package materials are used in the assembly and packaging for Pentium processors and are used in flip chips, which are used to eliminate the leads found in conventional packaging, reducing the pollution that can boost impedance and thus interfere with the performance of high-speed processors.
Where these package adaptations occur in a study setting, particularly a randomised design, this makes the intervention an evolving one, which needs to be taken into account in trial design and reporting.
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Thus, these software packages have limited utility.
However, these software packages remained in local use only.
"Do any of these package-design people actually shop for orange juice?" the writer of one e-mail message asked rhetorically.
Levi opened these packages at his desk.
These packages add up to $3,100.
These packages, though, do not include tickets.
These packages effectively subsidize low fares.
"We created these packages as an answer for these people".
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