Sentence examples for thermal pressing from inspiring English sources

We modified a previously reported thermal pressing method [23] by replacing the press plate with a curved mold.

The sealing of the devices was done by thermal pressing.

In the present study, the performance of such chevron-profiled membranes, prepared by thermal pressing, was experimentally validated in a reverse electrodialysis (RED) stack.

The coercivity of the Ni78Fe22 thin films is enhanced from 0.9 to 103 Oe by increasing the applied pressure from 0 to 1.0 MPa in the thermal pressing process.

Physicochemical analysis of the polymerized allylamine coatings (X-ray photoelectron spectroscopy and static water contact angle) showed that the coatings were resistant to the thermal pressing and were stable in ambient air and underwater up to 14 days of ageing, even if the water contact angle decreased during the underwater ageing.

The nHA-PA 66 scaffold was synthesized from nano-hydroxyapatite and polyamide 66 foamed by the thermal pressing and the injection molding techniques by Sichuan Guona Technology Co., Ltd (Chengdu, Sichuan, China).

AgNW/TRG/PVDF hybrid composites were prepared using solution mixing followed by coagulation and thermal hot pressing.

The mass loss via dehydrochlorination indicated by TGA and elemental analysis confirmed the crosslinking via thermal melt pressing.

Polyvinylidene fluoride (PVDF) composites filled with in situ thermally reduced graphene oxide (TRG) and silver nanowire (AgNW) were prepared using solution mixing followed by coagulation and thermal hot pressing.

The study shows that volumetric change rate is the most important indicator to evaluating buoyancy-driven performance of a thermal engine, isostatic pressing technology is effective to improve volumetric change rate, actual volumetric change rate can reach 89.2% of the theoretical value and the average power is about 124 W in a typical diving profile.

With advances in nanoelectronics and the emergence of new application areas such as three-dimensional chip stack architectures and flexible electronics, now more than ever there are both needs and opportunities for novel materials to help address some of these pressing thermal management challenges.