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Thermal management issues are limiting barriers to high density electronics packaging and miniaturization.
Scaled versions of fan designs are often chosen to address thermal management issues in space constrained applications.
The results are analyzed and current energy efficiency and thermal management issues are discussed with respect to the relative effectiveness of the various metrics.
For catalytic micro-combustors in particular, numerical studies focused on key thermal management issues, including impact of combustor materials and heat recirculation through the combustor walls.
Consequently, the series-RC model appears adequate for investigating thermal management issues of some, but not all large ECs and demonstrates that caution is needed when selecting capacitor electrical models to perform thermal management engineering.
This work addresses the potential of low profile integrated fan and heat sink solutions to electronics thermal management issues of the future, particularly focusing upon possible solutions in low profile portable electronics.
Our review shows that carbon-nanotube (CNT) when used as the structure of TIM or TIM filler could considerably advance thermal management issues by improving heat dissipation from the ECU.
The widespread use of data centers, the dramatical increase of the data center power density and the need for improving cooling system efficiency to maintain reliable operation temperature and save cooling energy make the study of data center thermal management an urgent issue.
Thermal management is an important issue in the development of micro-tubular stacks.
Therefore, the effective thermal management is a key issue for packaging of high performance semiconductors.
Thermal management is a key issue in various fields of engineering.
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