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This fast thermal curing speed was attributed to the large number of active cations generated upon UV exposure that facilitated the thermal polymerization process.
(a) Preexposure of the epoxysiloxane resist by a cold UV-light; (b) imprint with a mold that can be opaque; (c) thermal curing the imprinted resist; and (d) mold release from the resist.
The basic chemistry of the solder masks was an epoxy acrylate dual cure system (bisphenol-A based epoxy and methyl methacrylate) with typical photoimageable solder mask formulations, including photoinitiators, thermal curing agents, silica-filler, pigment and several organic solvents.
Average ASR expansion values of 0.012 and 0.002 % at 28 days were observed for untreated and thermally treated specimens, respectively, indicating the significant effect of thermal curing on UHPC ASR expansion.
DSC investigations showed that the thermal curing of the BMI resins could be accomplished at a lower temperature than the thermal curing temperatures of Buoxd and Sioxd, and the thermal processing window, i.e., the temperature range between the melting transition and thermal curing process, was over 26 °C.
The application of thermal curing further densifies UHPC, which results in higher compressive strength properties.
A simple method is described on the preparation of low surface-tension epoxy films via thermal curing.
In this paper, we present the results of the nanotribological characteristics of two perfluoropolyether-coated (PFPE) magnetic diamondlike carbon (DLC) film disks with and without thermal curing.
The two polycondensates are then mixed; the resulting resins are shaped into thin films and organically cross-linked via UV and/or thermal curing.
Tgs of the oligomers, which range from 245 to 269 °C, could be further increased at least by 94 °C upon thermal curing.
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The system proposed constitutes a new two-stage dual photo-thermal curing procedure for cycloaliphatic epoxy resins with a thermal latent character.
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