Sentence examples for thermal cured from inspiring English sources

The PHA/clay was subsequently thermal cured to PBO/clay.

Experimental results indicated that the interlaminar fracture toughness was increased by more than 66% compared to that of the traditional thermal cured samples without MWCNTs.

The epoxy functionalized CNT (ef-CNT) were dispersed in the LC BP epoxy resin that can be thermal cured with an equivalent of 4,4′-diamino-diphenylsulfone to form composite.

Polyester-based, polydimethylsiloxane (PDMS) modified waterborne, thermal cured hydrophobic coating was developed for corrosion protection of copper using hexa methoxymethyl)melamine (HMMM) as a cross-linker and para-toluene sulphonic acid (p-TSA) as catalyst.

This fast thermal curing speed was attributed to the large number of active cations generated upon UV exposure that facilitated the thermal polymerization process.

The basic chemistry of the solder masks was an epoxy acrylate dual cure system (bisphenol-A based epoxy and methyl methacrylate) with typical photoimageable solder mask formulations, including photoinitiators, thermal curing agents, silica-filler, pigment and several organic solvents.

(a) Preexposure of the epoxysiloxane resist by a cold UV-light; (b) imprint with a mold that can be opaque; (c) thermal curing the imprinted resist; and (d) mold release from the resist.

Herein, we report on a new liquid NIL resist based on epoxysiloxane oligomers that can be thermally cured within a short period of time in air at a moderate temperature using a UV-assisted thermal curing process.

The curing characteristics of clearcoats, including a thermal curing initiator (TRI) newly designed from O-imino-isourea and photo-initiator (PI), were investigated by means of different mono-curing and dual-curing pathways.

Average ASR expansion values of 0.012 and 0.002 % at 28 days were observed for untreated and thermally treated specimens, respectively, indicating the significant effect of thermal curing on UHPC ASR expansion.

DSC investigations showed that the thermal curing of the BMI resins could be accomplished at a lower temperature than the thermal curing temperatures of Buoxd and Sioxd, and the thermal processing window, i.e., the temperature range between the melting transition and thermal curing process, was over 26 °C.