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Look for an appealing shape and don't worry about the surface condition.
Clean: The surface condition without liquid.
We examined the possibility of describing the surface condition.
We investigate if depending on the surface condition, pull-out stresses can vary.
This lack of uniformity could be attributed to the surface condition of the wafer.
The reference data about the surface condition after machining process was analyzed.
At the same time, the existence position of the marker strongly depends on the surface condition.
The surface condition can be measured from the resistance force generated by wiping motion 2.
SEM analysis was used to observe the surface condition of the solids involved in these reactions.
Investigation of surface state description: We examined the possibility of describing the surface condition.
For each flooring material, the surface condition measurement using the wiping motion was performed.
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Justyna Jupowicz-Kozak
CEO of Professional Science Editing for Scientists @ prosciediting.com