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As can be clearly seen, equations (9) and (10) can be inverted analytically to get the solution for the complex conductivity thus avoiding the numerical procedure.
Part one of this paper introduces the numerical procedure.
The numerical procedure is straightforward and easy for computer implementation.
Presented numerical examples illustrate advantages of the numerical procedure proposed.
The numerical procedure is stable, converges easily, and can be easily implemented on computers.
Numerical and experimental results are provided which validate the numerical procedure.
The numerical procedure is based on the interpolating stabilized MLS ISMLSS) approximation.
Comparisons with theoretical and experimental results are used to validate the numerical procedure.
Membranes and cables in taut, wrinkled or slack state are considered adequately in the numerical procedure.
We will discuss the numerical procedure of a plasma surface interaction for etching.
Parts of the numerical procedure are adapted to run on a parallel computer.
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