Sentence examples for technology bonds from inspiring English sources

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The package, which fulfilled a campaign promise, called for, among other things, the creation of "technology bonds" to promote broadband access in rural communities.

But not only have bonds outperformed stocks for two years in a row, heading for a third, there is reason to believe technology bonds are systemically underpriced.

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In a comment thread here, Phil Windley, who I like and respect (we have a technology bond) but whose politics and mine couldn't be more opposite, said he might vote for Obama.

Based upon research involving two intergenerational teams comprising elementary school students and adults, whose task was to design a Web portal interface for young users, the authors present a new model for designing new technologies, "bonded design".

Monster ScreenClean with AEGIS technology permanently bonds to the surface of the cleaning cloth and inhibits the growth of micro organisms, effectively controlling a broad spectrum of bacteria, fungi, mold, mildew, yeast and other one-celled organisms".  .

His current research interests are three-dimensional integrated circuits (3D IC), through-silicon via (TSV) technology, wafer bonding technology, and heterogeneous integration.

The risk-management-focused technology a bond market needs is very different from the matching algorithms that dating markets like Yahoo! Personals rely on.

The purpose is to select the technology to bond the tiles, to qualify the different non-destructive examinations and to better define the relevant acceptance criteria for the serial production.

Adhesive bonding technology and especially bonded light metal joints play an important role in vehicle and aircraft construction [1].

Chip on board wire bonding presents challenges to modern wire bonding technology which include smaller, closely spaced wire bond pads; bonding to soft substrates without special processing and pad construction; and diverse first bond and second bond metallurgies.

Gold to gold interconnection (GGI) flip chip bonding technology has been developed to bond the drive IC chip on the integrated circuit suspension used in hard disk drives.

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