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The arrays fabricated on the different substrates were exposed to S. aureus for 18 h.
Silk-CNT substrates were exposed to UV for 1 h for sterilization purposes.
The substrates were exposed to the Indium (In) molecular beam at 350°C for 60 s (approximately two monolayers).
During the deposition process, the substrates were exposed in three different conditions: grounded, biased (−300 V) or heated (300 °C).
Polyimide films on silicon nitride substrates were exposed to moisture under varying conditions of relative humidity, time and temperature.
The substrates were exposed to a microbial agent including yeasts, celluleutic bacteria and lactic acid bacteria, which degraded the substrate before the actual start of the anaerobic digestion.
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Thus, HRP-modified PSiO2 is fixed in a flow cell setup and is exposed to various substrate/buffer combinations.
A mixture of resorcinol, surfactant, and ethanol coated on silicon substrates was exposed to formaldehyde vapor as a cross-linking agent to form structured resorcinol/formaldehyde resin films.
Another important factors are temperature, which defines the kinetics of the process[21], as well as the way the substrates is exposed to the polyelectrolytes solutions, for example, by dipping or spray[22].
During the folding process substrates are exposed to high-localized stresses, which in the case of coated papers and boards, can lead to decreased aesthetic features or complete loss of functionality.
A single shear lap solder joint specimen with lead-free eutectic Sn Ag solder on copper substrates was exposed to 1500 thermomechanical fatigue (TMF) cycles between −15° (3.5 h) and 150 °C (20 min) to generate intrinsic thermal strains.
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