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In order to study the fatigue mechanism and life, thermal mechanical stress and strain distributions of DBC substrates under thermal cycling ranged from − 55 °C to 150 °C were simulated and analyzed by finite element (FE) method.
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This paper presents board level reliability test results of a flex substrate BGA under thermal and bend cyclic tests.
Thermal cycling immersion tests proved the durability of the developed coatings and the subjacent steel substrate under cyclic thermal stress.
The agglomeration can also result in enhanced scattering for laser ablation from deeper within the substrate and coalescence under thermal effect due to the absorption of light for longer irradiation time.
In addition to the direct epitaxial growth of nanotube arrays on lattice-matched substrates, a solid-state reaction under thermal annealing and using readily available nanostructure arrays as templates could be an efficient way to generate novel chemically complex, multiphase nanotube arrays.
However, under thermal loading conditions, substrate warpage increases as substrate thickness decreases.
Fullerene was deposited on iron substrates via thermal evaporation under high vacuum conditions.
Then, 30 nm of Au as electrodes was deposited on the substrates by thermal evaporation under 5 × 10−7 Torr using a shadow mask at a deposition rate of 0.1 0.2 Å/s.
These results may provide some useful references for coating/substrate system design under thermal loading.
These results may provide some helpful references for the integrity of coating substrate systems under thermal loading.
Transparent conductive films of tin oxide were deposited on glass substrates under various deposition conditions.
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