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The developing list of wide gap substrates for device production is remarkable compared with a few years ago and continues to provide new device design possibilities.
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The vertically aligned CNTs could be selectively grown on a patterned catalyst layer and transferred onto a stretchable substrate for device applications such as a strain sensor (Fig. 3a) [13a.
However, graphene synthesis directly on substrates suitable for device applications, though highly demanded, remains unattainable and challenging.
We believe that, if combined with an improved transfer and bonding technology, this lift-off method could provide a simple and yet effective way to integrate GaN-based devices with Si circuits or other favorable substrates for power devices and high efficiency optoelectronic devices.
DNA substrates for the device were also constructed using a cassette-system.
The accurate positioning of the dots on pre-patterned substrates enables the utilization of these substrates for further device processing.
As thin-film coating, ZnO nanoparticles may themselves be used as piezoelectric substrates for SAW device [28].
The growth of good quality InAs quantum dots on Ge substrates for possible device applications is demonstrated.
The common method of preparing large-area graphene films is through chemical vapor deposition (CVD) on metallic substrates, which typically contains the transfer of the as-grown graphene onto target substrates for further device fabrication.
However, the graphene film obtained by these methods generally requires physical transfer onto the desired substrates for subsequent device processing [19, 20], which could introduce the defects and contaminations into the graphene film.
Especially, this review focuses on the applications of CPI films as flexible substrates for optoelectrical devices, such as flexible active matrix organic light emitting display devices (AMOLEDs), flexible printing circuit boards (FPCBs), and flexible solar cells.
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