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From a survey of literature [ 7, 9, 11– 15, 29– 33] on the use of various carbon sources for bacteria carrying out SND, the most common substrates applied by other investigators appeared to be glucose, sodium succinate, sodium acetate, and sodium citrate.
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The hydraulic retention time of the hydrolytic reactors was 11.2 days, and considering that the substrate feeding occurred in the period of 12 days before foaming in the methanogenic reactors, a peak in the total quantity of fed substrates was applied by the operator.
But the important and appreciable point in the simulations that involve live biological cells is the impact of the considered particle with AFM tip and substrate before the load is applied by the cantilever.
When a magnetic field is applied by the substrate, the magnetic moments will orient in the direction of the field and give rise to a net magnetization of the nanofibers.
In the case of the DASs and the DMSs, biasing could be applied by connecting the substrate to a center tap of an isolation transformer.
Previous researches created potential investigations relating forces applied by cell to substrate [28]-[30] [28]-[30]mbly of focal adhesions and the contrassemblyofces with respect to locomotion or cell migration [31]-[33].
Traction forces applied by the cell to the elastic substrate caused substrate deformations that were visualized by tracking fluorescent marker beads in the uppermost layer of the substrate (see above).
By measuring the distance pillars were bent (Fig. 6A) we could calculate the total force applied by the cell on the substrate (Fig. 6B).
This polymer-clay coating is applied by airbrushing an aqueous BPEI/MMT mixture onto any substrate.
In this work, current collectors made of metal lines were applied by magnetron sputtering on a transparent conducting glass substrate.
On the basis of FEM, the deformation of graphene in graphene/PDMS under indentation is very similar to that of graphene in free-standing indentation, and the main strain of graphene is not transferred by the graphene/substrate interface but directly applied by the indentation load, which creates a very low deformation mismatch across the interface (or a very low interface stress).
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