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With increasing Δ h, compressive stress arises within and near the contact area, and strong local tensile stress arises in the periphery of the contact area.
The main origin of this internal stress arises from the misfit between the substrate and the film.
The coupling between solid state diffusion and mechanical stress arises in a number of important technological applications.
In the Pacific Northwest, the stress arises from the Juan de Fuca plate trying to ram its way beneath the edge of North America.
Oxidative stress arises from an imbalance in the generation and metabolisms of ROS, with more of ROS being produced, than that is metabolized.
Shear stress arises from the friction between two virtual layers of a fluid and is induced by the difference in motion and viscosity between these layers.
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CHK1 is activated by the kinase ATR in response to DNA replication stress arising from DNA damage.
Large variations in flow stress arise from differences in Pc, the starting materials used, and the chemical environments.
This behavior was attributed to the relaxation of internal stress arising from the graphite manufacturing process and specimen machining.
The internal stress arising during the annealing process (σan) is evaluated using the model developed by Flinn et al. [1].
Pre-compression is often employed in practice to reduce tensile stress arising from internal pressure, axial force and self-weight.
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CEO of Professional Science Editing for Scientists @ prosciediting.com