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The mechanical strength of the layer was reduced owing to an increase in the layer thickness at increased heating temperatures.
This constraint produces stress distribution with a large component of hydrostatic tension, such that the normal stress on the interfaces can greatly exceed the tensile flow strength of the layer material.
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The optimization process targets minimizing the ratio of the stress developed in the layers to the strength of that layer for all the composite laminate layers.
Though a hardened layer is found in the bonding layer, the rupture strength of the bonding layer is more than 30 MPa, which is higher than the design stress in our application.
Scanning electron microscopy results showed that Zn was mainly deposited on the α-phase surface, and ultrasonic agitation at the initial stage of the zincate pretreatment improved the coverage of the Zn layer even on the β-phase surface, resulting in enhancement of the adhesion strength of the Zn layer and the successive Cu layer to the substrate.
Hardened layer due to the formation of AlAg2 was found in the bonding layer, however, the rupture strength of the bonding layer is more than 30 MPa, the calculated design stress.
The thicknesses of the kernel, buffer, and IPyC layers along with the strength of the SiC layer and the pressure in the TRISO particle did not significantly alter the results from the model.
The ratio of densities exceeding 1.0 indicates that the strength of the neutral layer at Es altitudes is strong relative to the main layer.
The vertical tensile strength of the outer layer AF is 15.68 Mpa and that of the inner layer is 6.664 Mpa.
The sensitivity study revealed that the growth strain, εg, was the dominant influential design parameter on the final hoop strain near the hole during the 20 thermal cycles, followed by the compressive yield strength of the TGO layer at RT and the tensile yield strength of the TGO layer at 1200 °C.
Building up an interface between the substrate and the plating layer is also an important subject to establish enough adhesion strength of the plating layer and low defect density to prohibit corrosion progress of the substrate.
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Justyna Jupowicz-Kozak
CEO of Professional Science Editing for Scientists @ prosciediting.com