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Oppositely, highly dispersed copper nanoparticles could be conjectured for the higher solvent proportion of 1 4.
To optimize the sheet resistance of the copper film, the solvent proportion for copper ink is adjusted systematically.
Relatively, the solvent proportion of 1 2 is the appropriate parameter because of moderate dispersion for copper nanoparticles.
We find the lowest sheet resistance of 47.5 mΩ/□ of the copper film for the solvent proportion of 1 2.
The sheet resistances of copper inks with the solvent proportion of 1 2 at different calcination temperatures and times are listed in Table 2.
We speculated that the copper nanoparticles could generate the agglomeration phenomenon under the solvent proportion of 1 1 since the concentration of tert-butanol in the solution is not enough to disperse the copper nanoparticles.
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Table 1 shows the sheet resistance of the copper films with solvent proportions of 1 4, 1 2, and 1 1.
The quantity of crude extracted material is found to depend on the solvent proportions according to a special cubic model.
Both solvent proportions (1 1 and 1 4) would produce bad film compactness and non-uniform film thickness, which caused the higher sheet resistance.
The composition of this mixed solution comprises a fixed weight of conductive copper nanoparticles (1 g) and different solvent proportions of water-free alcohol and tert-butanol.
In summary, we have provided a method for preparing antioxidant conductive copper ink and investigate the characteristics of copper films with different solvent proportions and calcination parameters.
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