Exact(3)
The results of this work provide a useful guidance for the development of high efficiency OSCs containing Ag NPs via solution fabrication route.
Organic bulk heterojunction solar cells using n-type inorganic metal oxide nanostructures as the electron transport channel have attracted considerable attentions because of its improved ambient device stability, low-cost manufacturing, and compatibility to solution fabrication process [1 4].
By optimizing the formation condition of the patterned defects and composition of the solution, fabrication of patterned nanostructures of various metallic species such as Au, Ag, and Co, was achieved.
Similar(57)
This report demonstrates a surface plasmon-enhanced polymer-based LED (PLED) architecture incorporating colloidal Ag nanoparticles in an all-solution fabrication process using orthogonal solvents.
Herein, we standardized optimal concentration (5%) of olive oil to get spinable solution for fabrication of oil blended nanofiberous membranes.
Moreover, among the reported literatures, the research on the solution phase fabrication of 1D In(OH 3 and 1D Inanotubestubes is rather limited.
In this work, we report the solution process fabrication of perovskite solar cells which comprised an architecture CH3NH3PbI3 perovskites formed by a solvent-engineering technology.
This kind of solution based fabrication of patterned low-dimensional high dielectric architectures might get potential significance for cost-effective technological applications.
The third Al(OH 3 powder was obtained from the reaction of AlCl3 and NaAlO2 solution, whose fabrication process was the same as that for Al(OH 3 AlCl3 except the aqueous solution was obtained at 50 °C.
Inkjet printing is inherently problematic in that it is a solution based fabrication process; the ejected ink droplet shows a different spreading behavior under different surface wettability after deposition onto substrates.
In this study, the native oxide layer on silicon was removed by HF solution before fabrication, and hence, it will lead to a rapid etching of silicon compared to the etching of bulk silicon surface [20, 21].
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