Sentence examples for solder strength from inspiring English sources

The shear fracture strength of the present solder ball joints generally increased as the shear strain rate increased due to the sensitivity of the bulk solder strength to the strain rate.

Overall, the average soldering strength improves from 165.5 to 298.3gf, which is 80.24% increase.

Furthermore, the study of shear displacement rate effect on the solder bump strength indicates that the analysis of bump strength versus thermal aging time should be identified as a qualitative analysis for solder bump strength determination rather than a quantitative one.

Existing metrologies, such as ball shear, do not always detect the weak solder joint strength.

The impact of the physical aging and reflow on the solder joint strength was investigated.

A peel test for solder joint strength evaluation of substrate was developed.

Dynamic solder joint strength is hypothesized to be controlled by two factors.

In this paper, the dynamic solder joint strength of Sn 3.9 Ag–0.7 Cu solder joints was experimentally measured over the strain rate range 10−3 12 s−1.

Solder bond strength of the Sn Ag alloy-plated specimen was not decreased after the exposure to the humid environment, and was increased by the Ni underlayer.

High strength solders can be engineered by adding trace amounts of nanopowders into solder paste.

The higher pull-off strength of solder mask A compared to that of solder mask B in the SM-BM configuration as well as both solder masks in the SM-Cu configuration, may be attributed to the failure mode.