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Parametric studies are conducted to analyze the influence of the pressure drop on the heat sink heat transfer resistance.
At present active air cooling devices comprised of various finned heat sink, heat pipe, and fan combinations is popular.
The model developed in this paper can be adapted for use with general heat sink, heat pipe, and thermoelectric systems.
The gain (temperature difference between source and sink heat exchangers) and frequency at which marginal stability (desirable continuous oscillations) can be achieved is calculated.
Table 5 Heat sink study configurations Case Configuration ORC-heat sink Heat sink position 1 Simple cycle (SC IC1 a 2 Parallel cycle (PC IC1 a 3 Simple cycle (SC IC2 b 4 Parallel cycle (PC IC2 b.
The optimization objective is to minimize the heat sink heat transfer resistance for a fixed pressure drop over the heat sink and a fixed heat production rate in the base plate.
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This results in an effective source-to-sink heat exchange system that is entirely passive while providing effective cooling.
In the example above, tin solder is used to "tack" aluminum together without heating the sink, and heat sink paste might achieve a better mating.
Heat sink combined with heat pipes technology can greatly improve the heat dissipation performance.
Thus, AABW production represents an important sink for heat and possibly CO2 (Sigman and Boyle 2000).
Some technologies use environmental sinks as heat dissipation alternatives.
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