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The BaTiO3 separation layers were grown repeatedly in perfect layer-by-layer mode on the irregular interface of strained NCs layers, which smoothed the irregular growth front formed in the self-assembled process of Ni NCs and provided a flat substrate for the next strained Ni NCs layer.
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The GaAs layers were grown directly on 3-in.
The SiGe layers were grown on 8-in.
The indium-containing layers were grown at approximately 485°C, while the (Al)GaAs layers were grown at approximately 580°C.
Finally, a 10 nm thick GaN cap layer was grown.
The InAs layer is grown at 500 °C.
The InGaN layer was grown at 550°C.
This layer was grown via atomic layer deposition (ALD) [5].
The SiO2 layer was grown by thermal oxidation.
The GaAs cap layers and QDs were grown at 540°C.
A 3 nm Al2O3 separation layer was included in the simulations to account for the surface oxide of Al.
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