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Twinning faults are observed in Cu substrate both during the indentation and retraction processes.
Growth and retraction processes of single branches are decreased to an average of 3 μm within 5 min and the dynamics show strikingly reduced variability between individual branches.
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In this work, we demonstrate portable self-retracting TENG (PSR-TENG) that can harvest mechanical energy through extraction and retraction process.
The combination of stacking and fluttering motion during the extraction and retraction process generates multiple power peaks in a single input.
Cross-sections made from plan-view transmission electron microscopy samples revealed that this was related to ridge formation during the retraction process.
Retraction process can also be clearly classified into two parts based on the profile of load depth curve in Fig. 2.
Figure 5 Atomic configurations of Cu substrate during the second part of retraction process at different depth: a η = −1.56 nm, b η = −3.5 nm.
If we assume the mass of the flake to be small, it is possible to depict the retraction process as a series of quasi-static steps.
This result infers that the retraction process overall appears to seldom find δφ as the next lower potential step to advance to.
By the optical microscope observation, it was confirmed that the disintegrated drop maintains the axisymmetrical ellipsoidal shape during the retraction process and was parallel to the observation plane.
While the equilibrium behavior of the networks can be well described by a mean field theory for rubber elasticity, the long time relaxational dynamics can be rationalized in terms of the Pearson-Helfand picture for the arm retraction process.
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