R1, R2, and R5 are the constant resistors with the same resistance as the undeformed resistive layer.
The 2D resistivity pseudo-sections obtained showed three different layers: one thin resistive layer interspersed by very resistant spots corresponding to woody roots, followed by a middle conductive one corresponding to moist soil, and a deeper layer with moderate resistivities.
Since the fresh resistive layer is usually in high resistance state, a much higher voltage, compared with the SET process, is needed to form the CF in the resistive layer, as shown in Fig. 10a [10a].
The device consisted of two low resistance sp2-rich contacts separated by a resistive layer with mixed sp2 and sp3 hybridisation states deposited using energetic deposition.
For the fresh RRAM devices, most of them show an initially very high resistance state and a forming operation is needed to form CF in the resistive layer.
The resistive layer should consist of non-stoichiometric lead oxides with semiconductor character.
In addition, oxygen species evolved from the surface can react with the electrolyte to form a resistive layer at the surface of the cathode particles, increasing the impedance of the cell18, 19.
First tests have been carried out with a Medipix chip where the protection of the resistive layer has been proved.
In this paper we present a Modal Deformable Mirror (MDM) based on the continuous voltage distribution over a resistive layer.
The sound absorption of material with poor sound absorption performance can be enhanced with a conveniently designed resistive layer.
This study points out the role that a resistive layer can have upstream on a porous material.
