This investigation focuses on the assessment of the residual (after cooling) bond strength between concrete and steel rebars of reinforced concrete elements after exposure to elevated temperature and how to restore the bond strength using different repairing techniques and materials.
The random distribution of indium in the later stages of growth occurred because of the solidification of residual melt when cooling was applied to the system.
In low misfit systems, all three sources contribute to the residual strain upon cooling, as result of incomplete lattice relaxation.
During further cooling, residual Sn-rich liquid exists and fills the gaps between the pre-solidified grains by capillary effects to form a network.
In addition, the thermally induced residual stresses during cooling down process, overall elastic properties and energy absorption capability of hollow reinforced composite are studied.
The approach involves capturing response of RC beams in three stages, namely, structural response at ambient conditions, thermo-mechanical response during fire exposure, and post-fire residual response after cooling down of beams.
In order to produce polyimide films in situ on silicon substrates, while minimizing the thermally induced residual stresses on cooling from the cure temperature, we have prepared various polyimide-polydimethylsiloxane based block copolymers derived from pyromellitic dianhydride (PMDA) and p,p′-oxydianiline (ODA) via the poly amic-alkyl ester) poly amic-alkyl.
The residual stresses upon cooling from a high-temperature stress-free state down to a room-temperature stressed state were studied as a function of thickness of the thermally grown oxide (TGO) layer taking into account the plasticity of the bond coat.
If plastic deformation is taken into account, the strain at the end of hot time is very small, so the ideal CTE should be based on the residual strain after cooling.
The thermal residual stress generated during cooling from the bonding temperature to room temperature is another criterion to evaluate the bond quality.
