Sentence examples for pt system from inspiring English sources

Currie [3] and Iseki and Taylor [4] identified a pure transfer penalty, independent of walking and waiting time, but dependent on other factors such as the availability of adequate information, safety, security, comfort and convenience, familiarity with the public transport (PT) system, and frequency of PT use.

Interestingly, our study revealed that protein C levels influence the PT, indicating that protein C plays a role in PT prolongation via the inactivation of FV and FVIII in the PT system in vitro, similar to coagulation in vivo.

Friman [19] describes how passenger opinions of the PT system quality declined in the face of such improvements, due to the level of disruption caused during their implementation.

The research question this review focused on is "What are the factors that influence commuters' willingness to ride an integrated public transport (PT) system?".

Our estimates show that approximately 56% of PT users make a single transfer, while 21% transfer more than once, highlighting the importance of optimising transfers to achieve an efficient and high-quality PT system.

It was found that the Nafion®-coated Pt system showed lower apparent ORR activity and more H2O2 production than the bare Pt electrode system.

For 8.2% Pt systems, the peak is also shifted, for 16.4% Pt systems, the characteristic peak of methanol oxidation is present only for samples treated at room temperature.

The benefits of using such unbonded PT systems include easier installation of strands and no need for grouting.

Because the use of encapsulated PT systems is now required in the U.S. for all elevated unbonded PT floors and would possibly be required even for slabs-on-ground in the U.S. or for PT construction in Korea soon, the test results in this study will help provide viable options for those in need and promote application of more durable PT systems.

Additional samples from other Ti Me C (Me = Al, Fe, Cu or Pt) systems were also examined, and notable sputter damage was observed.

The investigations were done in two parts: i) the formation and evolution of interconnection microstructures in AuSn | Cu, AuSn | Ni and AuSn | Pt systems were studied with bulk diffusion couples and ii) thin film structures (i.e. adhesion layers and diffusion barriers) for Pt metallization on AuSn SLID bonded wafers were investigated from manufacturability and reliability viewpoints.