This paper presents an effective thermal balancing policy for multi-core processors thermal management systems.
Modern high-performance processors employ thermal management systems, which rely on accurate readings of on-die thermal sensors.
As 3D chip multi-processors (3D-CMPs) become the main trend in processor development, various thermal management strategies have been recently proposed to optimize system performance while controlling the temperature of the system to stay below a threshold.
His current research interests include IoT platform prototyping; IoT communications; energy-efficient edge and cloud computing; power and thermal management of multi-core processors; low-power, embedded digital-signal processing; 3D integration; and CAD for VLSI, MEMS, and Silicon Photonics.
Considering the important role of electrical rectifiers (diodes) in electronics, thermal rectifiers have substantial implications for diverse thermal management problems, ranging from nanoscale calorimeters to microelectronic processors to macroscopic refrigerators and energy-saving buildings.
In addition to the obvious implications of unrestricted temperature, such as thermal emergencies resulting in hardware failure, effective thermal management reduces the cost of thermal packaging for processors while achieving long-term savings from reduced secondary cooling costs.
The Dynamic Power and Thermal Management (DPTM) system of Dynamic Voltage Frequency Scaling (DVFS) enabled processors compensates peak temperatures by slowing or even powering parts of the system down.
The microprocessor's temperature is controlled by the hardware thermal management system that continuously monitors the chip temperature and automatically reduces the processor's speed as soon as the thermal threshold is exceeded.
The VIA Nano processor family leverages advanced 65 nanometer process technology for enhanced power efficiency, and augments that with aggressive power and thermal management features within the compact 21mm x 21mm nanoBGA2 package for an idle power as low as 100mW (0.1W), extending the reach of power efficient green and silent PCs, thin and light notebooks and mini-notes around the world.
Top of the list is thermal management".
Thermal management of IC packages.
