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Meanwhile two advanced electro-chemically based processes for deposition of Al-scales were successfully developed.
For the past decade TNO has been involved in the research and development of atmospheric pressure CVD APCVDD) and plasma enhanced CVD (PECVD) processes for deposition of transparent conductive oxides (TCO), such as tin oxide and zinc oxide.
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Linear plasma sources can be used both in PECVD-processes for deposition of dielectric layers like oxides or nitrides and for plasma etching of substrates at dimensions of more than 1 × 1 m2.
A technological process for deposition of TiN, TiC, W, Ta coatings with and without Cu sublayer was developed and tested.
A process for deposition of tetragonal Cu2SnS3 (CTS) thin films from methanolic precursor solution of metal-thiourea complex by direct liquid coating (DLC) is described.
A novel process for deposition of thin AlN and Al coatings on particulate carbon materials by means of an atmospheric pressure microwave plasma fluidized bed treatment is reported.
The features of inverted architecture and solution process for deposition of organic and inorganic layers in this study provide a promising way to low-cost manufacturing in the future.
The clustering likely reflects deposit natural variance related to depositional processes, for example, deposition at the base of a slope, but may also be attributed to systematic uncertainty resulting from the isopach map preparation process.
We have developed processes for the deposition of conductive, boron-doped diamond films as well as for tribological crystalline diamond coatings on deposition areas up to 50 cm × 100 cm.
We present two different processes for the deposition of high quality CNT films on flexible substrates.
The plots of the growth velocity vs. time reflect the sequence of processes for the deposition of the film.
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