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Furthermore, there is ambiguity (and commercial variation) in the exact process temperature when UHT processing.
The process temperature remained below 100 °C.
The process temperature is generally in the range of 88° C (190° F).
The process temperature ranged between room temperature and 400 °C.
A thermocouple placed between the piece and the heating coils monitors the process temperature, which is regulated by an outside temperature controller.
Plasma-enhanced atomic layer deposition (PEALD) provides multiple benefits compared to thermal ALD including lower possible process temperature and a wider palette of possible materials.
The pad property changed steeply in the process temperature range from 60 to 80 °C.
Furthermore, the process temperature was monitored, which varied in the range of 370 474 °C.
A higher electric field at the same process temperature produced a larger decrease of E. coli.
The process temperature for anionic ion exchange resins was lowered to 515 °C.
The process temperature was 70 °C with a relatively high deposition rate of 36 nm/min.
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