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Subsequently, the aluminium oxide barrier layer is removed from the pore bottoms by a chemical etching process in a solution of phosphoric acid (H3PO4).
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In a typical process, a solution of nickel nitrate (nominal rate: 0, 0.1, or 0.2 M) and ethanol was dropped onto the Si substrate.
In the Bayer process bauxite is crushed, mixed in a solution of sodium hydroxide, and seeded with crystals to precipitate aluminum hydroxide.
The Al foil was slightly etched in a 1 M NaOH aqueous solution to remove any possible surface contaminations prior to surface-smoothing electropolishing process conducted at 20 V in a solution of perchloric acid (70 %) and ethanol (99.9%%) (1 4 volume ratio) at 5 °C for 15 min, using a Pt counter electrode.
The teeth were processed by immersing extracted them in a solution of sterilised deionised water (Milli-Q; Millipore, Bedford, Mass).
The specimens were primarily processed in a solution composed of (NaOH + Na2SiF6 + Na2SiO3·5H2O) for 900 s.
The electroless Au deposition process includes three steps: sensitization of frustules in a solution of 0.026 M SnCl2 and 0.07 M trifluoroacetic acid for 45 min followed by rinsing in Milli-Q water; activation step, where the sensitized frustules were immersed into a 100-mL ammoniacal solution of 0.029 M AgNO3 for 30 min.
After an electroless ion-exchanged process in an aqueous solution of 0.1 mol L−1 RbCl (or CsCl) for 10 min, the resulting Rb(Cs -modified assemblies showed an inCs -modifieditivity assembliesg showedity, while the working stanincreased further improved at dimethyldioctadecylammonium-protected asensitivity
An example of a possible energy diagram for a hypothetical one-stage process the dissociation in a solution of a covalent molecule designated E N, into its ions, E+ and N− is shown in the figure.
The composite membrane was obtained via a solution cast process in a mixture solvent of N, N-Dimethylacetamide (DMAc) and methanol (MeOH).
MnO2 thin film was then covered on NiO structures via a self-limiting process in aqueous solution of 0.5 M KMnO4 and 0.5 M Na2SO4 with a carbon layer serving as the sacrificial layer.
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