Sentence examples for process compatibility from inspiring English sources

Exact(21)

Material characterization demonstrated both material and process compatibility.

Specific applications require large amounts of high-performance, dense and low-cost non-volatile memories with CMOS standard process compatibility.

The proposed circuit operates stably at the supply voltage higher 1.2 V and has good process compatibility.

Here we present methods for the formulation of this electrolyte in the laboratory which ensure bath stability and process compatibility.

In commercial microelectronics, most devices are based on silicon technology and thus for process compatibility, a silicon substrate is a good precondition for applicability.

Recently, the usage of ZrO2 as the active switching layer has attracted attention because of its high thermodynamic stability, simple composition and semiconductor process compatibility [31 33].

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Similar(39)

It was found that the TiN and SS316 particles establish good metallurgical bond during the sintering process showing compatibility of matrix and reinforcement under nitrogen atmosphere.

Considering excellent process temperature compatibility between ALD of metal NPs and fabrication of a-IGZO TFT devices, the a-IGZO TFT memory with the charge storage medium of ALD Ni NPs was investigated in this article.

Meanwhile, in most reports on ZnO-based UV PDs, metal-semiconductor-metal (MSM) structures which provide an easy control, stable operation, simple fabrication process, and compatibility with various materials have been employed [1 6].

Finally, key challenges in different microfabrication techniques associated with their process and compatibility with commercial foundries are highlighted, as this aspect decides the viability of microactuators commercially and economically.

Due to a pragmatic trade-off between CMOS process baselines compatibility, improved performance compared to planar bulk architecture, and cost, bulk FinFETs emerged as the technological solution to provide downscaling for the 14/22 nm technological nodes.

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